SAHARA SX775-3E, Tobias CPU cooling system is a special high performance solution for main stream Socket LGA775 INTEL CPUs.
With it's small size & lichter weight is it suitable to DesK Top ATX Tower Micro to Slim Chassis.
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- 92*92*25 pwm fan with extreme low speed 1600RPM and low noise level max.17dBa
- 3*U 6mm diameter powder heat pipes & innovative construction for high performance of heat dissipation
- innovative exchangable remounting modules for LGA775 & AMD AM2 Sockets
- long life expectancy with Hydraulic fan
- Thermal Resistance:0,224 °C/W
all over dimension
L*W*H:98,20*95,00*68,50 mm
heat sink dimension
L*W*H:93,10*72,50*43,08 mm
fans dimension
2* 92,05*92,05*25,02mm
heat pipe Type
U-6mm diameter powder
fan speed
450-max.1600RPM adjustable
noise level
8- max.17dBa
bearing type
long life hydraulic bearing
power assumption
0,18Amp
power connection:
4PIN Molex2543/PWM signal
Max.air flow
28,04CFM
Life Expectancy:
50000hr by Amb. 45°C
Weight
343g
Thermal Interface Material
ShinEtsu 7783D
Thermal Resistance:
0,224 °C/W
Advantages of innovative powder heat pipes construction:
- higher heat dissipation efficiency:
The powder heat pipes plays an important role in the performance of thermal solution.
With it's wick structure of heat pipe offers the same performance in every orientations for ehe evaporation.
The new construction of 3 heat pipes which squeezed tails assembled the copper bottom base increase the keen reaction in any range of heating.
- minimization of heat sink dimension:
Because of the higher efficiency of heat dissipation of more than 10% than conventional coolers, we can reduce the heat sink dimension( stacked Alu fins) and reduce the weight.
Advantage of heat sink monimization:
- allow more air pressure from fan to surounding area on mainboard
- more powerful air stream blows on CPU copper block
- more powerful air stream blows on RAMs & VRAM area
